Layerava is a Hollow Cathode Plasma Enhanced Atomic Layer Deposition (HCP-ALD) system which is a versatile research tool designed for university and industrial research laboratories. Layerava is our PEALD + Thermal ALD capable platform.

Plasma introduces an alternative energy source for the ALD surface reactions in addition to thermal energy. This increases the range of available chemistries with the introduction of various neutral radicals and ion species and result in denser film deposition.

The Layerava system represents a significant advancement in plasma-assisted atomic layer deposition (ALD). Its compact chamber design, coupled with an advanced large-area high-density hollow cathode plasma source, sets it apart from the competition. The Layerava system effectively addresses the common issue of oxygen contamination from sputtered dielectric windows and eliminates the inefficiencies associated with plasma species dilution. The innovative chamber design, which is compact yet features a large plasma source, allows for direct deposition over the substrate with exceptional precision and efficiency. This design enables the generation of high-density plasma across the entire deposition area, avoiding the complications typically encountered with traditional ICP systems.